« Intel Corp. moved one step closer to developing its own mobile WiMAX solution on Wednesday when the company announced it had completed the design of its first WiMAX baseband chipset for use in laptops and other mobile devices. According to Intel's executive vice president and chief sales and marketing officers Sean Maloney, the new WiMAX Connection 2300 is a combination of the company's new chipset design and the previously announced single-chip, multi-band WiMAX/Wi-Fi radio. The chipset design was demoed on Wednesday during Maloney's keynote at the 3G World Congress and Mobility Marketplace in Hong Kong, where he showed a Centrino Duo mobile laptop with mobile WiMAX (IEEE 802.16e-2005), Wi-Fi (IEEE 802.11n), and high-speed downlink packet access (HSDPA) 3G capabilities successfully accessing the Internet at broadband speeds over a mobile WiMAX network. According to Dave Hofer, director of wireless marketing for the mobile platforms group at Intel, the announcement of Intel's WiMAX Connection 2300 will help further speed the deployment of mobile WiMAX, which is already moving along at a steady pace he said. "Our aim with WiMAX is to provide personal anytime/anywhere broadband connectivity," said Hofer. "This is a step along the way. We're at a point where, in 2007 and 2008, you're going to start seeing product samples."»

fonte: «Intel Develops Mobile WiMAX Chipset», PC Mag, 12/7/06